The Deep Application of CT Imaging Technology in Industrial Flaw Detection and Security Inspection Industry


Core technical principles


CT imaging is based on the X-ray penetration characteristics, obtaining attenuation data inside the object through multi angle scanning, and reconstructing three-dimensional tomographic images through filtering backprojection or iterative algorithms. The core difference between industrial and security CT lies in:


Industrial CT: Focusing on micrometer level defect detection with a resolution of 0.1 millimeters (such as cadmium zinc telluride photon counting technology);

Security CT: Emphasize automatic identification of hazardous materials, using spiral scanning to achieve second level 3D imaging.


Core value of industrial flaw detection


Non destructive high-precision testing


Quantitative analysis of internal defects (cracks, pores, etc.) in materials, with an accuracy 10 times higher than traditional flaw detection methods;

Applicable for integrity assessment of non removable components such as aircraft engine blades and cultural relics fossils.


Multidimensional application scenarios


Advantages of Domain Detection Object Technology

Interlayer debonding of aerospace composite materials and identification of 0.1 μ m level defects in turbine blade micropores

Virtual sectioning for engine cylinder block shrinkage and welding integrity in automobile manufacturing to avoid destructive testing

Microscopic imaging of electronic packaging BGA solder joints with virtual soldering and internal cracks in chips using nano focal ray source

Visualization of electrolyte distribution for electrode coating uniformity of new energy lithium batteries


Technological Transformation in the Security Inspection Industry

The leap from two-dimensional to three-dimensional

Traditional X-ray machine: only provides overlapping projection images, unable to distinguish liquid explosives from daily drinks;

CT security inspection machine: generates a three-dimensional voxel map through 360 ° spiral scanning, automatically annotates the location of hazardous materials (such as explosives and cutting tools), and alarms.


Breakthrough application of dual energy CT

Material identification: Using high/low energy dual band scanning to synchronously obtain object density and effective atomic number, accurately distinguish explosives and fertilizers and other similar substances;

Intelligent image detection: Combined with deep learning algorithms, the false alarm rate is reduced by 70% compared to traditional devices.

Performance comparison and industry demand


Parameter industrial CT security check CT

Resolution in micrometers (0.1mm) and millimeters (1-2mm)

Scanning speed in minutes (high-precision requirement) and seconds (≥ 180 packages/hour)

Quantitative analysis of core target defects and automatic identification of hazardous materials

Typical equipment: micro focal point radiation source+line array detector, cone beam radiation source+area array detector


Technological bottlenecks and innovation directions

Industrial CT Challenge: Difficulty in penetrating high-density materials (such as tungsten alloys) → Solution: Use a megavolt accelerator radiation source to enhance penetration power;

Limitations of security CT: Imaging artifacts in metal dense luggage → Innovative solution: Iterative reconstruction algorithm to suppress metal artifacts;

Common trend: Photon counting CT technology is gradually replacing energy integration detectors and improving material resolution capabilities.


Industrial CT is evolving towards nanoscale non-destructive analysis, while security CT focuses on seamless customs clearance scenarios, jointly promoting the intelligent boundary of non-contact detection technology.